High temperature one-part aluminum nitride based adhesive. Perfect for probes and sensors. Excellent for thermal conductivity. Bonds and seals ceramics to ceramics and ceramics to metals in applications up to 3000°F (1650°C).
Ceramabond 865 exhibits a dielectric strength of 187 volts per mil, torque strength of 27 ft-lbs, and coefficient of thermal expansion of 1.5 in/in/°F.
The product must be step cured at 200°F (93°C), 350°F (177°C), and 500°F (260°C) for 2 hours at each temperature. Applied in a thin coat using a brush, spatula or dispenser. The clearance between mating parts at operating temperature should be 2-8 mils (50-200 microns). Blistering may occur if the glue line is too thick or heating too rapid.
Ceramabond™ 503 is an inorganic, water-dispersed, aluminum oxide (alumina) filled adhesive that resists temperatures to 3200 °F (1760 °C) and is ideal for bonding alumina ceramics. It is applied easily by brush, spatula, or syringe and cures fully in 1-2 hours at 700 °F. Mechanical strength continues to improve with increases in temperature and tensile-shear strength of 900 psi can be achieved by curing further at 1000 °F.
Ceramabond™ 503 is an inert, chemically resistant material that will not outgas in ultra high vacuum (UHV).
It is also an exceptional electrical insulator providing a volume resistivity of 109 ohms-cm and dielectric strength of 250 volts/mil.
Typical applications for Ceramabond™ 503 include the assembly of dense ceramic components used in ultra high vacuum e, repairing of ceramic sager plates used in furnaces, potting thermocouples and gas sensors, and coating platinum/rhodium resistance wires to alumina heater cores.