美国UDM AKLC300系列浓缩晶圆切削液
AKLC300洗涤剂浓缩液是一种可生物降解、水性、非碱性、非酸性物质
PV wafer Cleaning after wafering
用于切片之后对光伏硅片进行清洗
DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1
去离子水/反渗透水:洗涤剂溶液比例 – 1000:1至500:1
Application temperature: 45°C - 70°C
使用温度：45°C - 70°C
Excellent wetting, cleaning and rinsing properties
极好的湿润、清洁和冲洗功能
Water surface tension reducer
降低去离子水/反渗透水表面张力
Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces
可以彻底清洁硅片表面的碳化硅(SiC)尘埃以及其他脏污
Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.
在切片以及去胶工序之后彻底清除光伏硅片表面的铜和铁
Biodegradable, non-hazardous and hence easily disposable
可生物降解、无危害，可以很容易进行处置
Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)
生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)
Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)
化学需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)
联系人：陈先生
手机：