BERGQUIST GAP FILLER 3600粘胶剂

t exhibits ultra high thermal performance and superior softness. This product has low modulus to help relieves CTE stresses in thermal cycling and also provide excellent vertical gap stability. This product can be used for fragile and low stress applications in various fields. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat.

Thermal conductivity: 3.6 W/m-K

Ultra low Modulus

Ultra conforming

Easily dispensable

UL94 V-0 compliance