BERGQUIST GAP FILLER 4000粘胶剂

BERGQUIST GAP FILLER TGF 4000 is a 4.0 W/m·K thermally conductive, ultra-conforming,silicone-based, two-part liquid gap filler designed for high-efficiency thermal management.

Thermal conductivity of 4.0 W/m·K for enhanced heat dissipation

Ultra-conforming silicone formulation for effective interface contact

Extended working time supports greater manufacturing flexibility

Low natural tack ideal for applications where strong structural bonding is not required

Cures at room temperature, with the option to accelerate the process using heat