2D锡膏测厚机
Laser Vision Measurement 品管量测设备
产品特性（FEATURES）
◆使用Window’s视窗介面，中/英文化书面，操作简单。
◆手动量测锡膏厚度
◆手动测量长、宽及两锡膏间之距离（间距）
◆测量值可记录存档及列印
◆提供厚度分布统计图表及X_Bar_R管制表
◆自动计算制程能力指标CP、CPK、CPM
◆可依不同生产线分别作记录
◆可依基板厚度调整焦距
◆可做定时呼叫取样
◆All operations are easy and using Windows interface in Chinese/English version.
◆Survey thickness of tin solder by auto matica lly or manually.
◆Survey the length and width manually,and the gap of tin solder.
◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.
◆All surveyed values can be recorded to a file and be printed to a report.
◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
◆Calculate man facture ability degree automatically(CP, CPK, CPM)
◆It can have proprietary record according to every different production ling.
◆It can adjust focus point in different thickness of PC boards.
◆It can be called to sample periodically.
适用（APPLECATION）
◆各式厚度量测数值取得统计分析
◆锡膏印刷机制程品管检查
◆锡膏印刷厚度良性测量
◆锡膏印刷成型，尺寸量测检查
◆提供其他物品测厚，测长，量测检查
◆Get the results of statistics and analysis about all surveyed values in every thickness degree.
◆Inspect the of solder printing process.
◆Survey the thickness benignancy of tin solder
◆Measure the dimension of tin solder
◆Provide thickness and dimension measurement function for other objects
功能（FUNCTION）
◆量测印刷锡膏厚度、长度、高度、间距。
◆提供厚度分布数值参考。
◆提供各种统计分析图表
X管制图、 R管制图、厚度列表
X平均值管制图 单点列表
◆Surveying the thickness of printing tin solder, length ,height and interval.
◆Provide the references of thickness distribution values.
◆Provide the analysis of different measure of cross-section.
◆Calculate the measure of area and volumn automa