1.84-1LMISR4DESCRIPTION
Ablebond® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach e The rheology of Ablebond
84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes Ablebond 84-1LMISR4 adhesive one of the most widely used die attach materials in the semiconductor industry.
2.84-1LMISR4FEATURES
• Excellent dispensability with minimal tailing and stringing
• Box oven cure
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1.84-1LMISR4银胶概述
Ablebond® 84-1LMISR4 导电粘晶胶 非常适用在高产率、自动粘晶设备 上。Ablebond® 84-1LMISR4 导电粘 晶胶的流变特性使得它可以进行最 小剂量的点胶，以及最小的粘晶停 留时间，并且没有拖尾或拉丝问 题。因此，Ablebond® 84-1LMISR4 独特的粘接性能使得它成为半导体 工业中最为常用的粘晶材料之一。
2.84-1LMISR4银胶特性
• 优良的点胶性能，具有最小的拖 尾或拉丝现象
• 箱式烘箱中固化