Bayblend T90 MF-20
PC/ABS
良好的流动性，高耐热性
20％矿物填充注塑级，非常良好的流动性，降低热膨胀系数，拉伸模量= 4900兆帕，高耐热性，维卡/ B 120 = 130°C。
Property Test Condition Unit Standard typical Value
Rheological properties
campus image Melt volume-flow rate 260 °C; 5 kg cm³/10 min ISO 1133 12
Molding shrinkage, parallel 150105x3 mm; 260 °C / MT 80 °C % b.o. ISO 2577 0.3 - 0.5
Molding shrinkage, normal 150105x3 mm; 260 °C / MT 80 °C % b.o. ISO 2577 0.25 - 0.45
Melt viscosity 1000 s-1; 260 °C Pa·s b.o. ISO 11443-A 240
Mechanical properties (23 °C/50 % r. h.)
campus image Tensile modulus 1 mm/min MPa ISO 527-1,-2 4900
campus image Yield stress 50 mm/min MPa ISO 527-1,-2 60
campus image Yield strain 50 mm/min % ISO 527-1,-2 3.2
Stress at break 50 mm/min MPa ISO 527-1,-2 50
Strain at break 50 mm/min % b.o. ISO 527-1,-2 9.0
Izod impact strength 23 °C kJ/m² ISO 180-U 100
Izod impact strength -30 °C kJ/m² ISO 180-U 50
Izod notched impact strength 23 °C kJ/m² ISO 180-A 20
Izod notched impact strength -30 °C kJ/m² ISO 180-A 6.0
Thermal properties
campus image Temperature of deflection under load 1.80 MPa °C ISO 75-1,-2 111
campus image Temperature of deflection under load 0.45 MPa °C ISO 75-1,-2 127
campus image Vicat softening temperature 50 N; 50 °C/h °C ISO 306 128
Vicat softening temperature 50 N; 120 °C/h °C ISO 306 130
campus image Coefficient of linear thermal expansion, parallel 23 to 55 °C 10-4/K ISO 11359-1,-2 0.4
campus image Coefficient of linear thermal expansion, transverse 23 to 55 °C 10-4/K ISO 11359-1,-2 0.56
campus image Burning behavior UL 94 [UL recognition] 0.85 mm Class UL 94 HB
Electrical properties (23 °C/50 % r. h.)
campus image Relative permittivity 100 Hz - IEC 60250 3.3
campus image Relative permittivity 1 MHz - IEC 60250 3.2
campus image Dissipation factor 100 Hz 10-4 IEC 60250 15
campus image Dissipation factor 1 MHz 10-4 IEC 60250 32
campus image Volume resistivity Ohm·m IEC 60093 1E1