Laird Tputty 508导热凝胶,可实现芯片组的高效散热,还具有卓越的润湿性,可确保低Rc(接触电阻)以实现热管理,即便在集成电路(IC)和中央处理器(CPU)等
Tputty™ 508 is ideal for applications that can benefit from automation and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty™ 508 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. Combined with Laird’s global technical support and global footprint, deploying Tputty™ 508 is easier than ever.