作业系统 Operating system: Windows XP
操作界面Operation interface: 中文界面及触摸屏操作
Chinese user interface and touch screen
工作周期时间 Cycle time: 240msec（最快max）{15k/h}
定位精度 Placement accuracy: ±1.5mil
角度精度 Angular accuracy: ±3°
晶片尺寸Applicable die size : 6mil×6mil~100mil×100mil
支持支架 Applicable workholders: 平面LED灯Horizontal LED lamp.
SMD(0603 0805).TOP SMD(3528 5050).
大功率High Power LED
双视觉系统Dual vision system: 精确及可调晶片图像识别定位系统
Precise and modulated pattern recognition system
电源Power supply: 220V±10V. 50Hz, 1.7KW
空气源（压力）Air source(Pressure):3~5kg/cm2
其他功能及配置Other features and configuration:
多晶元独立控制Multi—Wafer absolute control
漏晶检查测 Missing die detection
无限程序存储数量Unlimited program storage
LCD彩色显示屏LCD color monitors
内置式真空发生系统Internal vacuum pump system
内置不间断电源系统（UPS）（可选）Internal Uninterrupated Power Supply(UPS){optional}
Demensions and Weight体积和重量
体积[长×宽×