loctite乐泰 3549 PBC底部填充胶150ml

乐泰3549是新一代的返修，可提供热和机械可靠性。在快速固化在低温下对PBC板的减少热应力。快速流动，以提高处理时间。

PRODUCT DEscriptION

3549 provides the following product characteristics:

Technology： Epoxy

Appearance： Black

Components One-component

Product Benefits

● Reworkable

● Fast flow

● Low temperature cure

● High adhesion to flexible and rigid

substrates

● Excellent protection for solder joints

against induced stresses

Cure：          Heat Cure

Application： Underfill

Typical Assembly Applications：

                   BGA and CSP Devices

3549 epoxy reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and temperature cycle performance of the device.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Density, @ 25 °C, g/cm3                                     1.3

Viscosity @ 25 °C, mPa?6?7s (cP):

Haake PK100 @ 36 S-1                                        2,350

Cone & Plate, Spindle 52, speed 50 rpm               2,100

Filler Content, %                                                    18

Pot Life @ 25 °C(time to double viscosity), days    14

Shelf Life @ 2 to 8°C, year                                       1

Flash Point - See MSDS

TYPICAL CURING PERFORMANCE Recommended Cure Schedule

5 minutes @ 120 °C

3 minutes @ 130 °C

1 minute @ 150 °C reflow

Optional Reflow Cure (for Drop Test Reliability)

2 minutes @ 130°C

Substrate Temperature

Up to 70°C

Differential Scanning Calorimetry

Exotherm onset, °C 100 to 115

Peak Exotherm Temperature

Peak Temperature, °C 105 to 115