BERGQUIST GAP FILLER 3010APS粘胶剂

BERGQUIST GAP FILLER TGF 3010APS is a two-component, silicone-free, dispensable liquid gap filler engineered for demanding aerospace, aviation, defence, OEM, and MRO applications. Designed for extremely high throughput, it delivers an exceptional dispense rate of over 80 cc/sec and cures at room temperature, supporting efficient and scalable manufacturing processes.

This material combines high thermal conductivity of 3.0 W/m-K with low compressive stress, making it suitable for assemblies re reliable heat dissipation without introducing mechanical strain. Its compressible nature (Shore OO 75) ensures effective conformity to component surfaces, achieving stable long-term thermal contact in mission-critical electronic systems.

Key Properties:

Silicone-free, two-component liquid gap filler

High thermal conductivity: 3.0 W/m-K

Fast dispense rate: > 80 cc/sec for high-volume production

Compressible formulation (Shore OO 75) for low-stress assembly

Room temperature curing as standard

Ideal for high-throughput thermal management applications in aerospace electronics